Singapore licensed fund manager
Insights
Thematic Research - Co-Packaged Optics 101
By
Kenny Tan
The reports published on this website are provided for general informational purposes only and shall not be construed as an offer, solicitation, or recommendation to buy or sell any fund, security, or financial instrument referred to herein.
Co-Packaged Optics 101: The future of high-density AI interconnects
The largest architectural change in data-centre networking in a decade
KEY TAKEAWAYS
The copper wall is here. Above ~200Gbps per lane, copper can no longer carry signals more than a few metres without prohibitive power and signal-integrity penalties. The industry's answer is to move the optics off the faceplate and onto the chip package itself — Co-Packaged Optics (CPO).
Adoption is switch-first. NVIDIA and Broadcom are shipping CPO switches in 2026 on external-laser designs; the XPU side and an in-package laser are deferred by packaging and reliability limits, not yet solved.
Money moves with the architecture. As the optical engine moves into the package, value migrates away from module assemblers toward the layers that fabricate the optical engine itself.
The full report is prepared solely for informational and discussion purposes and is intended exclusively for accredited and institutional investors. By downloading the report, you confirm that you have read and accepted our Terms of Use.